Building Ascendancy in Technology

Wangda Technologies Pvt. Ltd. is an electronics manufacturing company specializing in Electronic Manufacturing Services (EMS). The company operates with advanced in-house capabilities, including Surface Mount Technology (SMT) lines, Final Assembly Testing and Packaging (FATP) lines, injection molding machines, and blister molding machines. These integrated facilities enable high-quality, scalable production of a wide range of electronic components and assemblies.

One Stop Solution
for Electronic Manufacturing

We provide comprehensive solutions tailored to meet your product and quality requirements. With advanced manufacturing capabilities and a skilled team, we ensure seamless integration, faster turnaround, and cost-effective production for global and domestic brands.

Strong Supply Chain.
Comprehensive Quality Control.
Well-equipped Manufacturing Facilities.

Our Services

SMT/MI

Our Surface Mount Technology (SMT) and Dual In-line Package (DIP) services ensure precise component placement and soldering for efficient electronic assembly.

FATP (Final Assembly, Testing & Packing)

With our Final Assembly, Test, and Pack (FATP) services, we guarantee the highest quality standards in assembling, testing, and packaging your electronic products.

Injection Moulding

Utilizing advanced injection moulding techniques, we produce high-quality plastic components for various electronic devices, meeting your design specifications.

Blister Tray

Utilizing advanced blister tray manufacturing techniques, we produce high-quality blister tray for the electronic component transporteration.